CLEANTHROUGH KS-2010半導體技術器件工序清理劑含高純凈度潤濕融入劑,中含合金材料陰離子和顆粒。CLEANTHROUGH KS-2010和SC1半導體技術器件難以清理效用一件(SC1難以清理液是氨水、雙氧水以其水的混和物,兩者面積比重為1:2:50。),其實中含有風險品。Product SpecificationProduct name:CLEANTHROUGH KS-2010